Xiaomi is already preparing the next big upgrade in its S-series lineup. After launching the Xiaomi 15S Pro earlier this year with its powerful in-house 3nm XRING 01 chipset, new leaks now suggest that the company is working on its successor — the Xiaomi 17S Pro. The upcoming flagship could debut in 2026 and introduce Xiaomi’s next-generation XRING processor.
Xiaomi 17S Pro: What the Latest Leak Reveals
Tipster Smart Pikachu on Weibo claims that Xiaomi will continue its usual release timeline, placing the Xiaomi 17S Pro on track for a 2026 launch. The device is expected to be the final addition to the Xiaomi 17 lineup, which currently consists of:
- Xiaomi 17
- Xiaomi 17 Pro
- Xiaomi 17 Pro Max
The Xiaomi 17 Ultra is also said to be arriving later this month.
According to the leak, the Xiaomi 17S Pro will be powered by the second-generation XRING chipset, possibly named XRING 02. Just like the 15S Pro, the new model may remain exclusive to the Chinese market, with no global launch expected.

Xiaomi 15S Pro: A Quick Look Back
For context, the Xiaomi 15S Pro — launched in May 2025 — introduced the company’s first in-house 3nm XRING 01 10-core chip. It was priced at CNY 5,499 (approximately ₹65,500) for the 16GB + 512GB variant.
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Key Specifications of the Xiaomi 15S Pro
- Display: 6.73-inch 2K OLED LTPO, 120Hz refresh rate, Ceramic Glass 2.0
- Chipset: XRING 01
- RAM/Storage: Up to 16GB RAM, up to 1TB storage
- Rear Cameras: Leica-tuned 50MP triple camera setup with Light Fusion 900 primary sensor
- Front Camera: 32MP
- Battery: 6,100mAh with 90W wired & 50W wireless fast charging
- Other Features: In-display fingerprint sensor, IP68 dust and water resistance
Conclusion
If the leaks prove accurate, the Xiaomi 17S Pro could offer major improvements with Xiaomi’s next-gen XRING 02 chipset. Positioned as the successor to the 15S Pro, it is set to close out the Xiaomi 17 series with a powerful, premium offering. With more details expected as we move closer to 2026, fans can look forward to another leap in Xiaomi’s in-house chip technology.
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